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S
E R V I C E S
A
P P L I C A T I O N S
T
E C H N O L O G I E S
C
O O P E R A T I O N S
H
O M E
C
O N T A C T
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SUBSTRATE
MATERIALS |
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PCB
- Ceramic - Thinfilm - Flex |
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SUBSTRATE
TECHNOLOGIES |
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THT
- SMT
- Micro Via - Built Up |
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COMPONENTS |
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BGA
- Chip Size Package - SOP |
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ASSEMBLY |
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SMT
- Chip On Board - Flip Chip |
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ADVANCED
SYSTEM DESIGN |
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MID
Technology - Si Etching |
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